Name | 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl |
Synonyms | GS4000,TMDE Tetramethylbiphenyl diglycidyl ether 4,4-DIGLYCIDYLOXY-3,3,5,5-TETRAMETHYL BIPHENYL 4,4'-diglycidyloxy-3,3',5,5'-tetramethyl biphenyl 3,3',5,5'-Tetramethyl-4,4'-(diglycidyloxy)biphenyl 3,3',5,5'-Tetramethyl-4,4'-diphenol diglycidyl ether 4,4'-Bis(glycidyloxy)-3,3',5,5'-tetramethylbiphenyl 3,3',5,5'-Tetramethyl-4,4'-diphenol diglycidyl ether 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl 3,5,3`,5`-Tetramethyl-4,4`-di(2,3-epoxypropanoxy)bibenzene 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl(1,1'-biphenyl) 2,2'-[(3,3',5,5'-tetramethylbiphenyl-4,4'-diyl)bis(oxymethanediyl)]dioxirane Oxirane, 2,2-(3,3,5,5-tetramethyl1,1-biphenyl-4,4-diyl)bis(oxymethylene)bis- 2,2'-{[3,3'5,5'-tetramethyl(1,1'-biphenyl)-4,4'-diyl]bis(oxymethylene)}bisoxirane 2,2'-{[3,3',5,5'-Tetramethyl(1,1'-biphenyl)-4,4'-diyl]bis(oxymethylene)}bisoxirane |
CAS | 85954-11-6 |
EINECS | 413-900-7 |
InChI | InChI=1/C22H26O4/c1-13-5-17(6-14(2)21(13)25-11-19-9-23-19)18-7-15(3)22(16(4)8-18)26-12-20-10-24-20/h5-8,19-20H,9-12H2,1-4H3 |
Molecular Formula | C22H26O4 |
Molar Mass | 354.44 |
Density | 1.149 |
Melting Point | 105°C |
Boling Point | 473°C |
Flash Point | 132°C |
Solubility | Benzene (Slightly, Sonicated), Chloroform (Slightly, Heated, Sonicated) |
Vapor Presure | 0mmHg at 25°C |
Appearance | Solid |
Color | Pale Yellow to Pale Beige |
Storage Condition | -20°C Freezer, Under inert atmosphere |
Refractive Index | 1.57 |
Physical and Chemical Properties | Appearance off-white powder melting point 104.0-110.0 ℃ content ≥ 98.5%( LC) volatile ≤ 0.2% ash ≤ 0.3% epoxy value ≥ 0.52 total chlorine ≤ 300ppm |
Use | Containing biphenyl structure diglycidyl ether type epoxy resin, with good color and transparency, compared with ordinary epoxy resin has excellent heat resistance and mechanical properties, high epoxy value, low total chlorine content and low physical and chemical properties and cost-effective, has been widely used as a variety of profiles, coatings, adhesives, composite resin matrix, especially in the electronic packaging materials with the ideal performance of the edge of the electric and popular, is a new type of epoxy resin |
Hazard Symbols | Xn - Harmful |
Risk Codes | 68 - Possible risk of irreversible effects |
Safety Description | S22 - Do not breathe dust. S36 - Wear suitable protective clothing. S37 - Wear suitable gloves. |
EPA chemical substance information | information provided by: ofmpeb.epa.gov (external link) |
Overview | electronic materials are the basis for the development of the microelectronics industry, as the main structural material for the production of integrated circuits, epoxy molding material is also developing rapidly with the development of chip technology, and the development of molding material technology will greatly promote the development of microelectronics industry. Biphenyl epoxy resin, especially 3,3 '5,5'-tetramethylbiphenyl bisphenol diglycidyl ether, has low viscosity, good adhesion, good solubility and high toughness, therefore, it is expected to be widely used in epoxy molding materials with high filling technology. |
Application | 3,3 '5,5'-tetramethylbiphenyl bisphenol diglycidyl ether is a light yellow crystal, it is solid at room temperature, easy to powder, and the melt viscosity becomes very low above the melting point. It is characterized by low melt viscosity, low moisture, high adhesion, can be filled into a large number of spherical silica filler powder, reduce the coefficient of thermal expansion. |
preparation | conventional preparation 3,3, 5, the method of 5 '-tetramethylbiphenyl diglycidyl ether is mainly prepared by NaOH one-step method, but in order to obtain the product with epoxy equivalent close to the theoretical value, the addition method of NaOH is strictly required, and the post-treatment of the reaction was cumbersome. Take isopropyl alcohol 10ml, epichlorohydrin 110g,3,3 ',5'-tetramethyl-4, 4 '-biphenol 14.52g, tetrabutylammonium bromide 0.15g, the reaction was stirred with nitrogen gas at 90 ℃ for 10 hours, and the solution containing 8g of sodium hydroxide with a concentration of 30% was added dropwise. At the same time, excess epichlorohydrin was distilled off under reduced pressure, after Suction filtration, the mixture of methanol/acetone (2: 1 volume ratio) is recrystallized twice. After the activated carbon is discolored, the light yellow 3,3'5 is obtained by vacuum drying at 70 ℃, 5'-tetramethylbiphenyl bisphenol diglycidyl ether 24.84g. Yield: 86%, epoxy equivalent: 189g/mol, Melting Point: 104-106 °c. |